| 2019 | Air chamber cavity for MEMS microphone was developed for production. |
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| 2019 | 200G, 400G Optical transceiver were developed for mass production. |
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| 2018 | TBGA was developed and qualified for networking, automotive and airospace applications. |
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| 2018 | 22um RF module by ELIC technology was developed and ready for volume production. |
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| 2016 | Cu core substrate technology was successfully developed and apply to mobile phone camera module for US mobile phone company. |
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| 2016 | 100G CWDM4 by Silicon Photonics Optical Transceiver was developed with embedded ceramics apply to hyper scale data center. |
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| 2016 | Qualified of wireless ear phone sensors, environment light sensor and proximity sensors for US mobile phones in high volume production. |
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| 2016 | Substrate for Bio sensor was qualified applied to smart watch. |
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| 2016 | Substrate for IRIS sensor was qualified for Korean mobile phone customer. |
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| 2015 | 25um RF module by ELIC technology was successfully developed for mass production. |
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| 2015 | Embedded MOSFET was successfully developed for power module for European semiconductor company. |
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| 2015 | Embedded Cu Slug was developed for PA modules on wireless communication station. |
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| 2014 | Pressure Sensor substrate was qualified by Eurpean MEMS sensor company and ship to European automotives. |
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| 2012 | High heat dissipation Copper stack substrate was developed for European LED company mass production. |
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| 2010 | Every Layer Interconnection technology was developed to apply to new RF modules for mobile phones. |
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| 2009 | High Power LED substrate was developed for lighting applications. |
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| 2002 | RF module qualified and ship to European mobile phones. |
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| 2000 | Unimicron Group took over high level management. |
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| 1998 | Start production of traditional PCB and substrate for PBGA. |
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