|
Substrate Type
|
Technology Specialties
|
|
SIP Substrate for :
RF FE Modules
PA Modules
Connectivity Modules
(wifi, bluetooth, … etc.)
|
More than 15 years HVM experiences in mobile phone
RF module substrates.
|
|
High layer count, fine pitch with thin substrate for high level design integration.
|
|
Embedded inductor / coil structure with high precision layer to layer registration.
|
|
Embedded thin film capacitor, resistor and component technology.
|
|
Signal integrity in NPI stage interaction in material, structure, circuit design,
…, etc
|
|
Signal Integrity in HVM stage by process control of metal thickness, dielectric
thickness, line width tolerance, surface roughness, …, etc
|
|
Thermal solutions for the design option.
|
|
Dimension control for fine pitch SMT processing.
|
|
Automation in backend inspection system, e-mapping system, 2DID for lot tracking
system.
|